Oxford Plasma Pro ICP-RIE ALE Ox-ALE |
Oxford Plasma Pro ICP-RIE ALE Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
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Oxford Dielectric Etcher oxford-rie |
Oxford Dielectric Etcher Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers |
Oxford Plasma Pro PECVD Ox-PECVD |
Oxford Plasma Pro PECVD Training |
Semiclean, Flexible |
SNF Paul G Allen L107 Cleanroom |
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Headway Manual Resist Spinner headway2 |
Resist Coat (manual) Headway Manual Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists |
SVG Develop Track 1 svgdev |
SVG Resist Develop tracks 1 and 2 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Automatic development. |
Prometrix Resistivity Mapping System prometrix |
Prometrix Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
3 Probe Heads for different cleanliness groups. |
EVG 101 Spray Coater evgspraycoat |
Spray Coater EVG 101 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Spray coating of resists |
Flexus 2320 Stress Tester stresstest |
Stress Tester Flexus 2320 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
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PlasmaTherm Shuttlelock PECVD System ccp-dep |
PlasmaTherm Shuttlelock PECVD System Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run |
SVG Resist Coat Track 1 svgcoat |
SVG Resist Coat Tracks 1 and 2 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Automatic Resist spinning and bake |
Wet Bench Flexcorr 1 wbflexcorr-1 |
Wet Bench Flexcorr 1and2 and 3and4 Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only. |
SPTS uetch vapor etch uetch |
SPTS uetch vapor etch Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Pieces need a carrier wafer; Isotropic Etching |
SVG Resist Coat Track 2 svgcoat2 |
SVG Resist Coat Tracks 1 and 2 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal. |
Wet Bench Flexcorr 2 wbflexcorr-2 |
Wet Bench Flexcorr 1and2 and 3and4 Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only |
HMDS Vapor Prime Oven, YES yes |
YES Prime Oven Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Two programs: Singe and HMDS prime or Singe only. No Resist allowed! |
SVG Develop Track 2 svgdev2 |
SVG Resist Develop tracks 1 and 2 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Automatic development. |
Wet Bench Miscellaneous wbmiscres |
Wet Bench Miscellaneous Photoresist Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents! |
Oven (White) white-oven |
White Oven Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable. |
Wet Bench Resist Strip wbresstrip-1 |
Wet Bench Resist Strip |
Clean (Ge), Semiclean, Flexible |
SNF Paul G Allen L107 Cleanroom |
Wet Resist Removal: SRS-100 or PRS1000 |
Oven BlueM 200°C to 430°C bluem |
Blue M Oven Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Convection in N2. Cure. Programmable. |