LEI1500 Contactless Sheet Resistance Mapping eddycurrent |
LEI1500 Contactless Sheet Resistance Mapping Training |
"All" |
SNF Exfab Paul G Allen 151 Ocean |
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Lesker Sputter lesker-sputter |
Sputter Lesker 1&2 Training |
Flexible |
SNF Exfab Paul G Allen 155A Venice |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |
Lesker2 Sputter lesker2-sputter |
Sputter Lesker 1&2 Training |
Semiclean |
SNF Paul G Allen L107 Cleanroom |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |
Matrix Plasma Resist Strip matrix |
Matrix Plasma Resist Strip Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating. |
micromanipulator6000 IV-CV probe station micromanipulator6000 |
micromanipulator6000 IV-CV probe station Training |
"All" |
SNF Exfab Paul G Allen 151 Ocean |
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Nanospec 210XP nanospec2 |
Nanospec Training |
"All" |
SNF Exfab Paul G Allen 104 Stinson |
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
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Oven (White) white-oven |
White Oven Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable. |
Oven 110°C post-bake oven110 |
Resist Postbake Oven 110°C Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Bakes wafers with resist after the development, called post-bake. |
Oven 90°C prebake oven90 |
Resist Prebake Oven 90°C Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Bakes wafers after resist coating. |
Oven BlueM 200°C to 430°C bluem |
Blue M Oven Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Convection in N2. Cure. Programmable. |
Oxford Dielectric Etcher oxford-rie |
Oxford Dielectric Etcher Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers |
Oxford Plasma Pro ICP-RIE ALE Ox-ALE |
Oxford Plasma Pro ICP-RIE ALE Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
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Oxford Plasma Pro PECVD Ox-PECVD |
Oxford Plasma Pro PECVD Training |
Semiclean, Flexible |
SNF Paul G Allen L107 Cleanroom |
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PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Parylene Coater Training |
Flexible |
SNF Exfab Paul G Allen 155 Mavericks |
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PlasmaTherm Shuttlelock PECVD System ccp-dep |
PlasmaTherm Shuttlelock PECVD System Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run |
Profilometer Alphastep 500 alphastep |
Alphastep 500 Profilometer Training |
Flexible |
SNF Exfab Paul G Allen 104 Stinson |
500Å to 300µm |
Profilometer AlphaStep D-300 alphastep2 |
AlphaStep2 Training |
Flexible |
SNF Exfab Paul G Allen 104 Stinson |
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Prometrix Resistivity Mapping System prometrix |
Prometrix Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
3 Probe Heads for different cleanliness groups. |
Samco PC300 Plasma Etch System samco |
Samco Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
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Savannah ALD savannah |
ALD Savannah Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
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