Heidelberg MLA 150 heidelberg |
Heidelberg Training |
"All" |
SNF Exfab Paul G Allen L104 Stinson |
Direct Write |
SEM -Zeiss Merlin sem-merlin |
SEM-Merlin Training |
"All" |
SNF Exfab Paul G Allen L104 Stinson |
|
Finetech Lambda flipchipbonder |
Flip Chip Bonder Training |
Flexible |
SNF Exfab Paul G Allen L104 Stinson |
|
Profilometer AlphaStep D-300 alphastep2 |
AlphaStep2 Training |
Flexible |
SNF Exfab Paul G Allen L104 Stinson |
|
Nanospec 210XP nanospec2 |
Nanospec Training |
"All" |
SNF Exfab Paul G Allen L104 Stinson |
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
|
Profilometer Alphastep 500 alphastep |
Alphastep 500 Profilometer Training |
Flexible |
SNF Exfab Paul G Allen L104 Stinson |
500Å to 300µm |
Keyence Digital Microscope VHX-6000 keyence |
Microscope Keyence Training |
"All" |
SNF Exfab Paul G Allen L104 Stinson |
|
Heidelberg3 heidelberg3 |
Heidelberg Training |
"All" |
SNF Exfab Paul G Allen L104 Stinson |
|
Wet Bench Resist Strip wbresstrip-1 |
Wet Bench Resist Strip |
Clean (Ge), Semiclean, Flexible |
SNF Paul G Allen L107 Cleanroom |
Wet Resist Removal: SRS-100 or PRS1000 |
Oven BlueM 200°C to 430°C bluem |
Blue M Oven Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Convection in N2. Cure. Programmable. |
Heidelberg MLA 150 - 2 heidelberg2 |
Heidelberg Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Direct Write |
Wet Bench Flexible Solvents 1 wbflexsolv-1 |
Wet Bench Flexible Solvents 1 and 2 Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Manual solvent cleaning, two ultrasonic baths. |
Oven 110°C post-bake oven110 |
Resist Postbake Oven 110°C Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Bakes wafers with resist after the development, called post-bake. |
Wet Bench Flexible Solvents 2 wbflexsolv-2 |
Wet Bench Flexible Solvents 1 and 2 Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Manual solvent cleaning, hot plate |
Oven 90°C prebake oven90 |
Resist Prebake Oven 90°C Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Bakes wafers after resist coating. |
Samco PC300 Plasma Etch System samco |
Samco Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
|
Wet Bench Solvent Lithography lithosolv |
Lithography Solvent Bench Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning. |
Karl Suss MA-6 Contact Aligner karlsuss2 |
Contact Aligner Karl Suss MA-6 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
1:1 Contact Aligner.
Backside align. |
Lesker2 Sputter lesker2-sputter |
Sputter Lesker 1&2 Training |
Semiclean |
SNF Paul G Allen L107 Cleanroom |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |
Wet Bench Flexcorr 3 wbflexcorr-3 |
Wet Bench Flexcorr 1and2 and 3and4 Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed. |