Silicon Germanium

Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists

1:1 Contact Aligner. Backside align.

CO2 drying after release of micromachined devices

Direct Write

To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

5:1 reducing stepper

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter