HMDS Vapor Prime Oven, YES yes |
YES Prime Oven Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Two programs: Singe and HMDS prime or Singe only. No Resist allowed! |
Tystar Bank 3 Tube 9 B3T9 Clean Oxide |
Tystar Atmospheric Tube Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
|
Fiji 3 ALD fiji3 |
ALD Fiji 3 Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Restricted to non-conductive films only |
Wet Bench Decontamination wbdecon |
Wet Bench Decontamination Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
KOH or wafersaw or post-cmp decontamination |
Oven (White) white-oven |
White Oven Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable. |
Intlvac Evaporator Intlvac_evap |
Evaporator Intlvac Training |
Clean, Semiclean |
SNF Paul G Allen L107 Cleanroom |
|
Tystar Bank 1 Tube 1 Anneal B1T1 Flexible Oxide |
Tystar Atmospheric Tube Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
|
Savannah ALD savannah |
ALD Savannah Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
|
Wet Bench Solvent Lithography lithosolv |
Lithography Solvent Bench Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning. |
Oven BlueM 200°C to 430°C bluem |
Blue M Oven Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Convection in N2. Cure. Programmable. |
SVG Resist Coat Track 2 svgcoat2 |
SVG Resist Coat Tracks 1 and 2 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal. |
Oxford Plasma Pro ICP-RIE Ox-gen |
Ox-gen etcher Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
|
Woollam woollam |
Woollam Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
|
Wet Bench Clean_res-piranha wbclean_res-piranha |
Wet Bench Clean Piranha/HF/Phosphoric Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
Resist will be removed |
Oven 110°C post-bake oven110 |
Resist Postbake Oven 110°C Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Bakes wafers with resist after the development, called post-bake. |
Wet Bench Clean 2 wbclean-2 |
Wet Bench Clean1and2 Training |
Clean |
SNF Paul G Allen L107 Cleanroom |
No resist allowed. Resist should have been removed at the wbclean_res-piranha |
Tystar Bank 1 Tube 3 Poly B1T3 Flexible Poly |
Tystar LPCVD Tube Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
|
Wet Bench Flexcorr 3 wbflexcorr-3 |
Wet Bench Flexcorr 1and2 and 3and4 Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed. |
Oven 90°C prebake oven90 |
Resist Prebake Oven 90°C Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Bakes wafers after resist coating. |
SVG Develop Track 2 svgdev2 |
SVG Resist Develop tracks 1 and 2 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Automatic development. |