"All"

Direct Write

To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

To maintain cleanliness level there are cleans required for both the chamber and wafers prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) .  Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

Isotropic Si etching; can be used for backside Si removal on small pieces

Automatic development.

SU-8, LOL, Ebeam resists allowed. No Acetone allowed. 

Spray coating of resists

Pieces need a carrier wafer; Isotropic Etching