The "Semiclean" cleanliness group is part of the SNF/ExFab contamination policy.
The following is a list of equipment that fall into the "Semiclean" category.
Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Process Temperature Range | Chemicals | Gases | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Wet Bench Resist Strip wbresstrip-1 |
Clean (Ge), Semiclean, Flexible |
20 °C - 60 °C
|
, , , , , , |
25 4 inch wafers | ||||||||
Wet Bench CMOS Metal wbclean3 |
Semiclean |
, , |
25 wafers | |||||||||
Tencor P2 Profilometer p2 |
Clean, Semiclean |
, , , , , , , , |
1 | |||||||||
Lesker2 Sputter lesker2-sputter |
Semiclean |
1.00 μm
|
°C - 800 °C
|
, , , , , , , , , |
one 4 inch wafer, one 6 inch wafer | |||||||
Lam Research TCP 9400 Poly Etcher lampoly |
Clean, Semiclean |
, |
25 | |||||||||
Intlvac Evaporator Intlvac_evap |
Clean, Semiclean |
0.00 -
0.50 μm
|
, , |
12 4 inch wafers, 2 6 inch wafers | ||||||||
Gasonics Aura Asher gasonics |
Clean, Semiclean | 25 | ||||||||||
Fiji 1 ALD fiji1 |
Semiclean |
1.00 Å -
50.00 nm
|
24 °C - 350 °C
|
, , |
||||||||
AMAT P5000 Etcher p5000etch |
Clean, Clean (Ge), Semiclean |