Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Manual solvent cleaning of substrates or resist removal.
1:1 Contact Aligner. Backside align.
CO2 drying after release of micromachined devices
1:1 Contact Aligner. Backside align, including IR.
Direct Write
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
No resist allowed. Resist should have been removed at the wbclean_res-piranha.
5:1 reducing stepper
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
