For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance
Al, Ti, or W wet etching or oxide etching
Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides.
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Automatic development.
non contact 3D optical profiling
Wet Resist Removal: SRS-100 or PRS1000
Spray coating of resists
Resist as mask allowed
Automatic Resist spinning and bake
3 Probe Heads for different cleanliness groups.
Manual solvent cleaning, two ultrasonic baths.
Pieces need a carrier wafer; Isotropic Etching
Manual solvent cleaning, hot plate