No resist allowed. Resist should have been removed at the wbclean_res-piranha.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
KOH or wafersaw or post-cmp decontamination
Direct Write
For more than 300nm deposition, please contact staff in advance.
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
non contact 3D optical profiling
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Isotropic Si etching; can be used for backside Si removal on small pieces
