KOH or wafersaw or post-cmp decontamination
Convection in N2. Cure. Programmable.
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Bakes wafers with resist after the development, called post-bake.
No resist allowed. Resist should have been removed at the wbclean_res-piranha
Resist will be removed
Bakes wafers after resist coating.
Automatic development.
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
1:1 Contact Aligner. Backside align.
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Manual solvent cleaning of substrates or resist removal.
1:1 Contact Aligner. Backside align, including IR.