Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
Direct Write
500Å to 300µm
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers
For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in advance
For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance
Al, Ti, or W wet etching or oxide etching
Automatic development.
non contact 3D optical profiling
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Spray coating of resists
Wet Resist Removal: SRS-100 or PRS1000
