1:1 Contact Aligner. Backside align, including IR.
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
3 Probe Heads for different cleanliness groups.
Pieces need a carrier wafer; Isotropic Etching
Automatic Resist spinning and bake
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
Automatic development.
Resist will be removed
Resist should have been removed
Resist as mask allowed
Al, Ti, or W wet etching or oxide etching
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only