reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
1:1 Contact Aligner. Backside align.
1:1 Contact Aligner. Backside align, including IR.
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Direct Write
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Aligned single-walled carbon nanotube growth with ST-cut quartz substrates (available from SNF stockroom);1-15 single-walled carbon nanotubes per micron density
Spray coating of resists
CO2 drying after release of micromachined devices
For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance
