Manual solvent cleaning, hot plate
Manual solvent cleaning, two ultrasonic baths.
Manual solvent cleaning of substrates or resist removal.
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Convection in N2. Cure. Programmable.
1:1 Contact Aligner. Backside align.
1:1 Contact Aligner. Backside align, including IR.
Direct Write
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance