For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Direct Write
1:1 Contact Aligner. Backside align.
1:1 Contact Aligner. Backside align, including IR.
Convection in N2. Cure. Programmable.
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Manual solvent cleaning of substrates or resist removal.
Manual solvent cleaning, two ultrasonic baths.
Manual solvent cleaning, hot plate