Compound materials with chemical elements from the III and V groups of the periodic table.
3 Probe Heads for different cleanliness groups.
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
Direct Write
500Å to 300µm
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Bakes wafers after resist coating.
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
1:1 Contact Aligner. Backside align.
Manual solvent cleaning, two ultrasonic baths.
1:1 Contact Aligner. Backside align, including IR.
Manual solvent cleaning, hot plate
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
non contact 3D optical profiling
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.