Compound materials with chemical elements from the III and V groups of the periodic table.
Direct Write
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
500Å to 300µm
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Bakes wafers with resist after the development, called post-bake.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Bakes wafers after resist coating.
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
1:1 Contact Aligner. Backside align.
Manual solvent cleaning, two ultrasonic baths.
1:1 Contact Aligner. Backside align, including IR.
Manual solvent cleaning, hot plate
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.