Compound materials with chemical elements from the III and V groups of the periodic table.
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
1:1 Contact Aligner. Backside align.
Manual solvent cleaning, two ultrasonic baths.
1:1 Contact Aligner. Backside align, including IR.
Manual solvent cleaning, hot plate
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
non contact 3D optical profiling
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Manual solvent cleaning of substrates or resist removal.
3 Probe Heads for different cleanliness groups.
CO2 drying after release of micromachined devices
Isotropic Si etching; can be used for backside Si removal on small pieces
Restricted to non-conductive films only
Automatic development.
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.