Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
1:1 Contact Aligner. Backside align.
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
1:1 Contact Aligner. Backside align, including IR.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Manual solvent cleaning of substrates or resist removal.
5:1 reducing stepper
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
