1:1 Contact Aligner. Backside align.
1:1 Contact Aligner. Backside align, including IR.
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Spray coating of resists
CO2 drying after release of micromachined devices
Convection in N2. Cure. Programmable.
5:1 reducing stepper
500Å to 300µm
Bakes wafers with resist after the development, called post-bake.
Bakes wafers after resist coating.
