1:1 Contact Aligner. Backside align.
1:1 Contact Aligner. Backside align, including IR.
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Direct Write
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Spray coating of resists
CO2 drying after release of micromachined devices
5:1 reducing stepper
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
