Bakes wafers after resist coating.
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
1:1 Contact Aligner. Backside align.
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
1:1 Contact Aligner. Backside align, including IR.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Manual solvent cleaning of substrates or resist removal.
5:1 reducing stepper
CO2 drying after release of micromachined devices
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
Isotropic Si etching; can be used for backside Si removal on small pieces
non contact 3D optical profiling
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
