3 Probe Heads for different cleanliness groups.
Spray coating of resists
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
Automatic Resist spinning and bake
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Pieces need a carrier wafer; Isotropic Etching
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Automatic development.
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
Wet Resist Removal: SRS-100 or PRS1000
Convection in N2. Cure. Programmable.
Direct Write
Manual solvent cleaning, two ultrasonic baths.
Bakes wafers with resist after the development, called post-bake.
Manual solvent cleaning, hot plate
