Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
Isotropic Si etching; can be used for backside Si removal on small pieces
non contact 3D optical profiling
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Automatic development.
3 Probe Heads for different cleanliness groups.
Spray coating of resists
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
Automatic Resist spinning and bake
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Pieces need a carrier wafer; Isotropic Etching
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
