Glass

Chemical Formula:

SiO₂

Equipment Tables

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Notes
HMDS Vapor Prime Oven, YES yes	YES Prime Oven Training	"All"	SNF Paul G Allen L107 Cleanroom	Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Xactix Xenon Difluoride Etcher xactix	Xactix Xenon Difluoride Etcher Training	"All"	SNF Paul G Allen L107 Cleanroom	Isotropic Si etching; can be used for backside Si removal on small pieces
Wet Bench Resist Strip wbresstrip-1	Wet Bench Resist Strip	Clean (Ge), Semiclean, Flexible	SNF Paul G Allen L107 Cleanroom	Wet Resist Removal: SRS-100 or PRS1000
Wet Bench Miscellaneous wbmiscres	Wet Bench Miscellaneous Photoresist Training	Flexible	SNF Paul G Allen L107 Cleanroom	Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Wet Bench Flexible Solvents 1 wbflexsolv-1	Wet Bench Flexible Solvents 1 and 2 Training	Flexible	SNF Paul G Allen L107 Cleanroom	Manual solvent cleaning, two ultrasonic baths.
Wet Bench Flexible Solvents 2 wbflexsolv-2	Wet Bench Flexible Solvents 1 and 2 Training	Flexible	SNF Paul G Allen L107 Cleanroom	Manual solvent cleaning, hot plate
Wet Bench Flexible Solvents wbflexsolv	Wet Bench Flexible Solvents 1 and 2 Training	Flexible	SNF Paul G Allen L107 Cleanroom	Manual solvent cleaning of substrates or resist removal.
Wet Bench Flexcorr 2 wbflexcorr-2	Wet Bench Flexcorr 1and2 and 3and4 Training	Flexible	SNF Paul G Allen L107 Cleanroom	Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Wet Bench Flexcorr 3 wbflexcorr-3	Wet Bench Flexcorr 1and2 and 3and4 Training	Flexible	SNF Paul G Allen L107 Cleanroom	Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Wet Bench Flexcorr 1 wbflexcorr-1	Wet Bench Flexcorr 1and2 and 3and4 Training	Flexible	SNF Paul G Allen L107 Cleanroom	Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
SVG Develop Track 2 svgdev2	SVG Resist Develop tracks 1 and 2 Training	"All"	SNF Paul G Allen L107 Cleanroom	Automatic development.
SVG Develop Track 1 svgdev	SVG Resist Develop tracks 1 and 2 Training	"All"	SNF Paul G Allen L107 Cleanroom	Automatic development.
SVG Resist Coat Track 1 svgcoat	SVG Resist Coat Tracks 1 and 2 Training	"All"	SNF Paul G Allen L107 Cleanroom	Automatic Resist spinning and bake
SVG Resist Coat Track 2 svgcoat2	SVG Resist Coat Tracks 1 and 2 Training	"All"	SNF Paul G Allen L107 Cleanroom	Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
SPTS uetch vapor etch uetch	SPTS uetch vapor etch Training	"All"	SNF Paul G Allen L107 Cleanroom	Pieces need a carrier wafer; Isotropic Etching
Prometrix Resistivity Mapping System prometrix	Prometrix Training	"All"	SNF Paul G Allen L107 Cleanroom	3 Probe Heads for different cleanliness groups.
PlasmaTherm Shuttlelock PECVD System ccp-dep	PlasmaTherm Shuttlelock PECVD System Training	"All"	SNF Paul G Allen L107 Cleanroom	To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing - Substrates in clean category: Pre-Diffusion Clean For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
Oxford Dielectric Etcher oxford-rie	Oxford Dielectric Etcher Training	Flexible	SNF Paul G Allen L107 Cleanroom	4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers
Nanospec 210XP nanospec2	Nanospec Training	"All"	SNF Exfab Paul G Allen L104 Stinson	Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
Micromanipulator6000 IV-CV probe station micromanipulator6000	micromanipulator6000 IV-CV probe station Training	"All"	SNF Exfab Paul G Allen 151 Ocean

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