Direct Write
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
500Å to 300µm
Manual solvent cleaning, hot plate
Bakes wafers after resist coating.
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
1:1 Contact Aligner. Backside align.
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
1:1 Contact Aligner. Backside align, including IR.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Manual solvent cleaning of substrates or resist removal.
5:1 reducing stepper
CO2 drying after release of micromachined devices