Automatic development.
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
Wet Resist Removal: SRS-100 or PRS1000
Convection in N2. Cure. Programmable.
Direct Write
Manual solvent cleaning, two ultrasonic baths.
Bakes wafers with resist after the development, called post-bake.
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
