Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
500Å to 300µm
Direct Write
CO2 drying after release of micromachined devices
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
Isotropic Si etching; can be used for backside Si removal on small pieces
non contact 3D optical profiling
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Automatic development.
3 Probe Heads for different cleanliness groups.
