Direct Write
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
500Å to 300µm
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Automatic development.
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
Wet Resist Removal: SRS-100 or PRS1000
Convection in N2. Cure. Programmable.
Manual solvent cleaning, two ultrasonic baths.
Bakes wafers with resist after the development, called post-bake.
Manual solvent cleaning, hot plate