To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
3 Probe Heads for different cleanliness groups.
Pieces need a carrier wafer; Isotropic Etching
Automatic Resist spinning and bake
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
Automatic development.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Manual solvent cleaning, two ultrasonic baths.
Manual solvent cleaning, hot plate
Manual solvent cleaning of substrates or resist removal.
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Wet Resist Removal: SRS-100 or PRS1000
Isotropic Si etching; can be used for backside Si removal on small pieces
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
non contact 3D optical profiling
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
