Bakes wafers after resist coating.
Bakes wafers with resist after the development, called post-bake.
500Å to 300µm
5:1 reducing stepper
Convection in N2. Cure. Programmable.
CO2 drying after release of micromachined devices
Spray coating of resists
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
1:1 Contact Aligner. Backside align.
1:1 Contact Aligner. Backside align, including IR.
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers
