For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
5:1 reducing stepper
CO2 drying after release of micromachined devices
Spray coating of resists
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Direct Write
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
1:1 Contact Aligner. Backside align.
1:1 Contact Aligner. Backside align, including IR.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
