Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
CO2 drying after release of micromachined devices
Convection in N2. Cure. Programmable.
500Å to 300µm
Bakes wafers with resist after the development, called post-bake.
Bakes wafers after resist coating.
For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in advance