Automatic development.
Automatic Resist spinning and bake
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Pieces need a carrier wafer; Isotropic Etching
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
Direct Write
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Convection in N2. Cure. Programmable.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Bakes wafers with resist after the development, called post-bake.
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Bakes wafers after resist coating.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Wet Resist Removal: SRS-100 or PRS1000
