3 Probe Heads for different cleanliness groups.
Direct Write
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
500Å to 300µm
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Convection in N2. Cure. Programmable.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Bakes wafers with resist after the development, called post-bake.
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Bakes wafers after resist coating.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
