| Equipment name & NEMO ID | Technique | Cleanliness | Material Thickness Range | Materials Lab Supplied | Minimum Resolution | Exposure Wavelength | Resist | Process Temperature Range | Chemicals | Gases | Substrate Size | Substrate Type | Maximum Load |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Heidelberg MLA 150 - 2 heidelberg2 |
"All" |
|
375 nm | 1 | |||||||||
|
Heidelberg MLA 150 heidelberg |
"All" |
|
405 nm | 1 | |||||||||
|
Headway Manual Resist Spinner headway2 |
"All" | one piece or wafer | |||||||||||
|
Flexus 2320 Stress Tester stresstest |
"All" | 1 | |||||||||||
|
Finetech Lambda flipchipbonder |
Flexible |
°C - 400 °C
|
1 | ||||||||||
|
Fiji 2 ALD fiji2 |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 350 °C
|
||||||||||
|
DISCO Wafer Saw DISCO wafersaw |
Flexible | 1x4", 1x6" or 1x8" wafer, or pieces | |||||||||||
|
Critical Point Dryer Tousimis Automegasamdri-936 cpd |
Flexible | ||||||||||||
|
CHA Solutions II Evaporator cha-evap |
Flexible |
0.00 -
300.00 nm
|
4"x15 or 6"x3 wafers or pieces | ||||||||||
|
AJA2 Evaporator aja2-evap |
Flexible |
0.00 -
300.00 nm
|
4"x3 or 6"x1 wafers or pieces | ||||||||||
|
AJA Evaporator aja-evap |
Flexible |
0.00 -
300.00 nm
|
4"x3 or 6"x1 wafers or pieces |