3 Probe Heads for different cleanliness groups.
500Å to 300µm
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
Convection in N2. Cure. Programmable.
Bakes wafers after resist coating.
Bakes wafers with resist after the development, called post-bake.
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
1:1 Contact Aligner. Backside align.
1:1 Contact Aligner. Backside align, including IR.
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
