Isotropic Si etching; can be used for backside Si removal on small pieces
Wet Resist Removal: SRS-100 or PRS1000
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Manual solvent cleaning, two ultrasonic baths.
Manual solvent cleaning, hot plate
Manual solvent cleaning of substrates or resist removal.
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Automatic development.
Automatic Resist spinning and bake
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
Pieces need a carrier wafer; Isotropic Etching
3 Probe Heads for different cleanliness groups.
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
1:1 Contact Aligner. Backside align.