Direct Write
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
500Å to 300µm
Manual solvent cleaning, two ultrasonic baths.
1:1 Contact Aligner. Backside align, including IR.
Manual solvent cleaning, hot plate
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
non contact 3D optical profiling
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Manual solvent cleaning of substrates or resist removal.
3 Probe Heads for different cleanliness groups.
CO2 drying after release of micromachined devices
Isotropic Si etching; can be used for backside Si removal on small pieces
Automatic development.
