Convection in N2. Cure. Programmable.
500Å to 300µm
3 Probe Heads for different cleanliness groups.
non contact 3D optical profiling
Pieces need a carrier wafer; Isotropic Etching
Automatic development.
Automatic Resist spinning and bake
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Manual solvent cleaning of substrates or resist removal.
Manual solvent cleaning, two ultrasonic baths.
Manual solvent cleaning, hot plate
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.