Convection in N2. Cure. Programmable.
Bakes wafers after resist coating.
Bakes wafers with resist after the development, called post-bake.
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
1:1 Contact Aligner. Backside align.
1:1 Contact Aligner. Backside align, including IR.
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Direct Write
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
CO2 drying after release of micromachined devices
