Isotropic Si etching; can be used for backside Si removal on small pieces
Automatic development.
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
Automatic Resist spinning and bake
Pieces need a carrier wafer; Isotropic Etching
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Direct Write
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Convection in N2. Cure. Programmable.
Bakes wafers with resist after the development, called post-bake.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
500Å to 300µm
