3 Probe Heads for different cleanliness groups.
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
500Å to 300µm
Direct Write
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Convection in N2. Cure. Programmable.
Bakes wafers with resist after the development, called post-bake.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Bakes wafers after resist coating.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
1:1 Contact Aligner. Backside align.
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
