reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Bakes wafers after resist coating.
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
1:1 Contact Aligner. Backside align.
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
1:1 Contact Aligner. Backside align, including IR.
Manual solvent cleaning, two ultrasonic baths.
Manual solvent cleaning, hot plate
non contact 3D optical profiling
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Manual solvent cleaning of substrates or resist removal.
3 Probe Heads for different cleanliness groups.
CO2 drying after release of micromachined devices
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
