Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Materials User Supplied | Minimum Resolution | Exposure Wavelength | Mask Size | Max Exposure Area | Resist | Process Temperature Range | Chemicals | Gases | Sample Size Limits | Resolution Notes | Substrate Size | Substrate Type | Maximum Load |
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Gasonics Aura Asher gasonics |
Clean, Semiclean | 25 | ||||||||||||||||||
Headway 3 Manual Resist Spinner headway3 |
All | 1 piece or wafer | ||||||||||||||||||
Headway Manual Resist Spinner headway2 |
All |
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one piece or wafer | |||||||||||||||||
Heidelberg MLA 150 heidelberg |
All |
|
405 nm |
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1 | |||||||||||||||
Heidelberg MLA 150 - 2 heidelberg2 |
All |
|
375 nm |
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1 | |||||||||||||||
HMDS Vapor Prime Oven, YES yes |
All |
150 ºC
|
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Intlvac Evaporator Intlvac_evap |
Clean, Semiclean |
0.00 -
0.50 μm
|
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12 4 inch wafers, 2 6 inch wafers | ||||||||||||||||
Karl Suss MA-6 Contact Aligner karlsuss2 |
All |
|
365 nm or 405 nm | 4 inch, 5 inch, 7 inch | 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch |
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Karl Suss MA-6 Contact Aligner karlsuss |
All |
|
365 nm | 4 inch, 5 inch, 7 inch | 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch |
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Keyence Digital Microscope VHX-6000 keyence |
All |
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Lam Research TCP 9400 Poly Etcher lampoly |
Clean, Semiclean |
, |
25 | |||||||||||||||||
Laurell Manual Resist Spinner laurell-R |
All | |||||||||||||||||||
LEI1500 Contactless Sheet Resistance Mapping eddycurrent |
All | 8 in wafer |
Sensor Transducer Size is 14 mm diameter |
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1 wafer(2" to 8") | |||||||||||||||
Lesker Sputter lesker-sputter |
Flexible |
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1 4 inch wafer, 1 6 inch wafer | |||||||||||||||||
Lesker2 Sputter lesker2-sputter |
Semiclean |
1.00 μm
|
°C - 800 °C
|
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one 4 inch wafer, one 6 inch wafer | |||||||||||||||
Matrix Plasma Resist Strip matrix |
Flexible |
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25 | |||||||||||||||||
micromanipulator6000 IV-CV probe station micromanipulator6000 |
All |
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1x4" wafer | |||||||||||||||||
MRC Reactive Ion Etcher mrc |
Flexible | 1 | ||||||||||||||||||
MVD mvd |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 150 °C
|
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Nanospec 210XP nanospec2 |
All |
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