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4 inch wafer

Short Name: 
4"

The following is a list of equipment where 4 inch round substrates are allowed.

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Equipment name & NEMO ID Training Required & Charges Cleanliness Locationsort ascending Notes
Samco PC300 Plasma Etch System
samco
Samco Training Flexible SNF Cleanroom Paul G Allen L107
Tystar Bank 3 Tube 11 TEOS
B3T11 Clean TEOS
Tystar LPCVD Tube Training Clean SNF Cleanroom Paul G Allen L107
Wet Bench Clean_res- hotphos
wbclean_res-hotphos
Wet Bench Clean Piranha/HF/Phosphoric Training Clean SNF Cleanroom Paul G Allen L107

Resist should have been removed

Wet Bench Clean 1
wbclean-1
Wet Bench Clean1and2 Training Clean SNF Cleanroom Paul G Allen L107

No resist allowed. Resist should have been removed at the wbclean_res-piranha.

Oven (White)
white-oven
White Oven Training Flexible SNF Cleanroom Paul G Allen L107

For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.

Flexus 2320 Stress Tester
stresstest
Stress Tester Flexus 2320 Training All SNF Cleanroom Paul G Allen L107
Lesker2 Sputter
lesker2-sputter
Sputter Lesker 1&2 Training Semiclean SNF Cleanroom Paul G Allen L107

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Tystar Bank 2 Tube 8 LTO
B2T8 Clean LTO
Tystar LPCVD Tube Training Clean SNF Cleanroom Paul G Allen L107
Wet Bench Flexcorr 1
wbflexcorr-1
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.

MRC Reactive Ion Etcher
mrc
MRC Reactive Ion Etcher Training Flexible SNF Cleanroom Paul G Allen L107

Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode

Oven BlueM 200°C to 430°C
bluem
Blue M Oven Training Flexible SNF Cleanroom Paul G Allen L107

Convection in N2. Cure. Programmable.

AJA2 Evaporator
aja2-evap
Evaporator AJA2 Training Flexible SNF Cleanroom Paul G Allen L107

For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in advance

CHA Solutions II Evaporator
cha-evap
Evaporator CHA Training Flexible SNF Cleanroom Paul G Allen L107

For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance

Wet Bench Flexcorr 2
wbflexcorr-2
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only

Gasonics Aura Asher
gasonics
Resist Removal Dry Gasonics Training Clean, Semiclean SNF Cleanroom Paul G Allen L107

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps.

Oven 110°C post-bake
oven110
Resist Postbake Oven 110°C Training All SNF Cleanroom Paul G Allen L107

Bakes wafers with resist after the development, called post-bake.

Intlvac Evaporator
Intlvac_evap
Evaporator Intlvac Training Clean, Semiclean SNF Cleanroom Paul G Allen L107
Fiji 2 ALD
fiji2
ALD Fiji 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107
Wet Bench CMOS Metal
wbclean3
Wet Bench CMOS Metal (wbclean3) Training Semiclean SNF Cleanroom Paul G Allen L107

Al, Ti, or W wet etching or oxide etching

Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Plasma Therm Versaline LL ICP Metal Etcher Training Flexible SNF Cleanroom Paul G Allen L107

Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)

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Equipment name & NEMO ID Technique Cleaning Required Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Resist Developer Process Temperature Range Gases Sample Size Limits Substrate Size Substrate Type Maximum Load
RTA AllWin 610
aw610_r
Flexible
21 °C - 1150 °C
,
,
Samco PC300 Plasma Etch System
samco
Flexible
20 ºC
,
,
,
,
,
,
,
,
,
,
,
,
,
Four 4" wafers or two 6" wafers and one 8" wafer
Savannah ALD
savannah
Flexible
1.00 Å - 50.00 nm
24 °C - 250 °C
,
,
,
,
,
,
,
,
,
,
,
,
SEM -Zeiss Merlin
sem-merlin
All
0.00 mm - 35.00 mm
6 in wafer ,
,
,
,
,
,
,
,
,
,
Sensofar S-neox
s-neox
All ,
,
,
,
,
,
,
,
1
Sinton Lifetime Tester
sinton-lifetime-tester
Flexible
SPTS uetch vapor etch
uetch
All ,
,
,
,
,
,
,
,
,
1
SVG Develop Track 1
svgdev
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Develop Track 2
svgdev2
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Resist Coat Track 1
svgcoat
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Resist Coat Track 2
svgcoat2
All
,
,
,
,
,
,
,
,
25 4 inch wafers
Technics Asher
technics
Flexible
,
,
Four 4" wafers to pieces, one 6" or 8" wafer
Tencor P2 Profilometer
p2
Clean, Semiclean ,
,
,
,
,
,
,
,
1
Tystar Bank 1 Tube 1 Anneal
B1T1 Flexible Oxide
Flexible
25.00 Å - 2.00 μm
400 °C - 1100 °C
,
,
100
Tystar Bank 1 Tube 2
B1T2 Flexible Oxide
Flexible
25.00 Å - 2.00 μm
400 °C - 1100 °C
,
,
100
Tystar Bank 1 Tube 3 Poly
B1T3 Flexible Poly
Flexible
25.00 Å - 2.00 μm
420 °C - 630 °C
,
,
,
,
,
100
Tystar Bank 1 Tube 4 LTO
B1T4 Flexible LTO
Flexible
25.00 Å - 2.00 μm
300 °C - 500 °C
,
,
,
,
,
100
Tystar Bank 2 Tube 5
B2T5 Clean Anneal
Pre-Diffusion Clean Clean
25.00 Å - 2.00 μm
400 °C - 1100 °C
,
,
100
Tystar Bank 2 Tube 6
B2T6 Clean Oxide
Pre-Diffusion Clean Clean
25.00 Å - 2.00 μm
400 °C - 1100 °C
,
,
100
Tystar Bank 2 Tube 7 Nitride
B2T7 Clean Nitride
Pre-Diffusion Clean Clean
25.00 Å - 2.00 μm
420 °C - 800 °C
,
,
50

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