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4 inch wafer

Short Name: 
4"

The following is a list of equipment where 4 inch round substrates are allowed.

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Equipment name & NEMO ID Training Required & Charges Cleanliness Locationsort ascending Notes
Plasmaetch PE-50
plasma-etch
Plasmaetch PE-50 Training Flexible SNF Exfab Paul G Allen 155 Mavericks

Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment At SNF - nSiL lab

PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Parylene Coater Training Flexible SNF Exfab Paul G Allen 155 Mavericks
Aixtron MOCVD - III-N system
aix-ccs
MOCVD - III-N Aixtron training Clean (MOCVD) SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For Sapphire clean: SC1, SC2.
For GaN template on Si or Sapphire: Piranha, SC1, SC2.

Aixtron MOCVD - III-V system
aix200
MOCVD - III-V Aixtron training Flexible SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For III-V clean: HCl or HF dip.

First Nano carbon nanotube CVD furnace
cvd-nanotube
cvd-nanotube training Flexible SNF Exfab Paul G Allen L119 Año Nuevo

Aligned single-walled carbon nanotube growth with ST-cut quartz substrates (available from SNF stockroom);1-15 single-walled carbon nanotubes per micron density

Aixtron Black Magic graphene CVD furnace
aixtron-graphene
CVD graphene furnace Aixtron Black Magic training Flexible SNF Exfab Paul G Allen L119 Año Nuevo
Optomec Printer
optomec-printer
Optomec Printer Training Flexible SNF Exfab Paul G Allen 155A Venice
AJA Evaporator
aja-evap
Evaporator AJA training Flexible SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

Lesker Sputter
lesker-sputter
Sputter Lesker 1&2 Training Flexible SNF Exfab Paul G Allen 155A Venice

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

DISCO Wafer Saw
DISCO wafersaw
Wafersaw DISCO training Flexible SNF Exfab Paul G Allen 159 Capitola
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
LEI1500 Contactless Sheet Resistance Mapping Training All SNF Exfab Paul G Allen 151 Ocean
micromanipulator6000 IV-CV probe station
micromanipulator6000
micromanipulator6000 IV-CV probe station Training All SNF Exfab Paul G Allen 151 Ocean
Sinton Lifetime Tester
sinton-lifetime-tester
Sinton Lifetime Tester Training Flexible SNF Exfab Paul G Allen 151 Ocean
Fiji 1 ALD
fiji1
ALD Fiji 1 and 2 Training Semiclean SNF Cleanroom Paul G Allen L107
Wet Bench Decontamination
wbdecon
Wet Bench Decontamination Training Clean SNF Cleanroom Paul G Allen L107

KOH or wafersaw or post-cmp decontamination

SVG Develop Track 1
svgdev
SVG Resist Develop tracks 1 and 2 Training All SNF Cleanroom Paul G Allen L107

Automatic development.

Tystar Bank 1 Tube 3 Poly
B1T3 Flexible Poly
Tystar LPCVD Tube Training Flexible SNF Cleanroom Paul G Allen L107
Oxford III-V etcher
Ox-35
Oxford III-V etcher Training Flexible SNF Cleanroom Paul G Allen L107

Metal etching or  Metal hard masks are not allowed. 4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only.

Wet Bench Solvent Lithography
lithosolv
Lithography Solvent Bench Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.

Laurell Manual Resist Spinner
laurell-R
Laurell Manual Resist Spinner Training All SNF Cleanroom Paul G Allen L107

SU-8, LOL, Ebeam resists allowed. No Acetone allowed. 

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Equipment name & NEMO ID Technique Cleaning Required Cleanliness Material Thickness Range Materials Lab Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Developer Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
Aixtron Black Magic graphene CVD furnace
aixtron-graphene
Flexible
800 °C - 1100 °C
,
1x4" wafer or Copper/Nickel foil
Aixtron MOCVD - III-N system
aix-ccs
Clean (MOCVD)
0.00 - 5.00 μm
400 °C - 1300 °C
,
,
,
4"x1, 2"X3, pieces
Aixtron MOCVD - III-V system
aix200
Pre-Diffusion Clean Flexible
0.00 - 5.00 μm
300 °C - 800 °C
,
,
,
4"x1 wafer or 2"x1 wafer or 4 pieces
AJA Evaporator
aja-evap
Flexible
0.00 - 300.00 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
AJA2 Evaporator
aja2-evap
Flexible
0.00 - 300.00 nm
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
AMAT Centurion Epitaxial System
epi2
Pre-Diffusion Clean Clean
50.00 Å - 3.00 μm
600 °C - 1200 °C
1
ASML PAS 5500/60 i-line Stepper
asml
All
365 nm 5 inch
,
,
,
,
CHA Solutions II Evaporator
cha-evap
Flexible
0.00 - 300.00 nm
,
,
,
,
,
4"x15 or 6"x3 wafers or pieces
Critical Point Dryer Tousimis Automegasamdri-936
cpd
Flexible
,
,
,
,
,
,
,
,
,
DISCO Wafer Saw
DISCO wafersaw
Flexible ,
,
,
,
,
,
,
1x4", 1x6" or 1x8" wafer, or pieces
EVG 101 Spray Coater
evgspraycoat
All ,
,
,
,
1
EVG Contact Aligner
evalign
All
350 - 450 nm 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch ,
,
,
,
one piece or wafer
Ex Fab Develop Wet Bench
wbexfab_dev
Flexible
Ex Fab Solvent Wet Bench
wbexfab_solv
Flexible
Fiji 1 ALD
fiji1
Semiclean
1.00 Å - 50.00 nm
24 °C - 350 °C
,
,
Fiji 2 ALD
fiji2
Flexible
1.00 Å - 50.00 nm
24 °C - 350 °C
,
,
,
,
,
,
,
,
,
,
,
,
Fiji 3 ALD
fiji3
Flexible
1.00 Å - 50.00 nm
24 °C - 350 °C
,
,
Finetech Lambda
flipchipbonder
Flexible
°C - 400 °C
,
,
,
,
,
1
First Nano carbon nanotube CVD furnace
cvd-nanotube
Flexible
800 °C - 1100 °C
,
1x4" wafer or multiple pieces
Flexus 2320 Stress Tester
stresstest
All ,
,
,
,
,
,
,
,
1

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