Manual development of resist in beakers. SNF approved developers only. No solvents!
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
500Å to 300µm
Direct Write
Manual solvent cleaning, two ultrasonic baths.
Pieces need a carrier wafer; Isotropic Etching
Restricted to non-conductive films only
Manual solvent cleaning, hot plate
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
No resist allowed. Resist should have been removed at the wbclean_res-piranha
Reactor located inside glovebox
KOH or wafersaw or post-cmp decontamination