Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Convection in N2. Cure. Programmable.
Resist will be removed
Bakes wafers with resist after the development, called post-bake.
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Bakes wafers after resist coating.
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Manual solvent cleaning of substrates or resist removal.
1:1 Contact Aligner. Backside align.
CO2 drying after release of micromachined devices
1:1 Contact Aligner. Backside align, including IR.
