reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
SU-8, LOL, Ebeam resists allowed. No Acetone allowed.
1:1 Contact Aligner. Backside align.
1:1 Contact Aligner. Backside align, including IR.
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Direct Write
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
3 probe heads for different cleanliness groups.
Restricted to non-conductive films only
Manual development of resist in beakers. SNF approved developers only. No solvents!
