Restricted to non-conductive films only
Reactor located inside glovebox
For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in advance
Bakes wafers after resist coating.
Bakes wafers with resist after the development, called post-bake.
500Å to 300µm
Convection in N2. Cure. Programmable.
CO2 drying after release of micromachined devices
Spray coating of resists
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
1:1 Contact Aligner. Backside align.
1:1 Contact Aligner. Backside align, including IR.
SU-8, LOL, Ebeam resists allowed. No Acetone allowed.
