Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)
Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment.
500Å to 300µm
3 Probe Heads for different cleanliness groups.
non contact 3D optical profiling
Pieces need a carrier wafer; Isotropic Etching
